| Description |
1 online resource (208 pages) |
|
data file rda |
| Contents |
Front Cover; Contents; Preface; Authors; Partial list of abbreviations, acronyms, and symbols; Chapter 1: History and background; Chapter 2: Package form factors and families; Chapter 3: Surface-mount technology; Chapter 4: Other packaging needs; Chapter 5: Reliability testing; Chapter 6: Polymers; Chapter 7: Metals; Chapter 8: Ceramics and glasses; Chapter 9: Trends and challenges; Chapter 10: Light-emitting diodes; Glossary; Appendix A: Analytical tools; Appendix B: Destructive tools and tests; Back Cover. |
| Summary |
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing--package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how. |
| Note |
Print version record. |
| Bibliography |
Includes bibliographical references. |
| Local Note |
Taylor & Francis Taylor & Francis eBooks: Open Access |
| Subject |
Microelectronic packaging.
|
|
Microelectronic packaging. (OCoLC)fst01019751
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| Other Form: |
Print version: Chen, Andrea. Semiconductor Packaging : Materials Interaction and Reliability. Hoboken : CRC Press, ©2011 9781439862056 |
| ISBN |
9781439862070 |
|
1439862079 |
|
9786613274601 |
|
6613274607 |
|
1283274604 |
|
9781283274609 |
|
1439862052 |
|
9781439862056 |
|
